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348

IGBT Kit

Hardware kits for power semiconductor modules, including copper components, clamping plates and mounting parts.

Component details

Hardware kits for power semiconductor modules, including copper components, clamping plates and mounting parts. Stamped baseplates and injection-moulded housings. Baseplate: T2 copper; terminals: T2 copper; housing: PBT with 30% glass fibre. Nickel-plated components have smooth, burr-free surfaces and support salt-spray testing.

Model
348
Minimum order
25 pieces
Housing
PBT + 30% glass fibre
Baseplate
T2 copper
Terminals
T2 copper

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